NXP USA Inc. NX3L1G53GM,125

NX3L1G53GM,125


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: NX3L1G53GM,125
  • Package: 8-XFQFN Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: NX3L1G53GM,125(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Switch Circuit SPDT
Multiplexer/Demultiplexer Circuit 2:1
Number of Circuits 1
On-State Resistance (Max) 750mOhm
Channel-to-Channel Matching (ΔRon) 20mOhm
Voltage - Supply, Single (V+) 1.4V ~ 4.3V
Voltage - Supply, Dual (V±) -
Switch Time (Ton, Toff) (Max) 24ns, 8ns
-3db Bandwidth 60MHz
Charge Injection 15pC
Channel Capacitance (CS(off), CD(off)) 35pF
Current - Leakage (IS(off)) (Max) 10nA
Crosstalk -90dB @ 100kHz
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 8-XFQFN Exposed Pad
Supplier Device Package 8-XQFNU (1.6x1.6)
Base Product Number NX3L1G53
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 4,000
1 Circuit IC Switch 2:1 750mOhm 8-XQFNU (1.6x1.6)
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