NXP USA Inc. P1011NXE2DFB

P1011NXE2DFB


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P1011NXE2DFB
  • Package: 689-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: P1011NXE2DFB(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series *
Package Tray
Product Status Obsolete
Mounting Type Surface Mount
Package / Case 689-BBGA Exposed Pad
Supplier Device Package 689-TEPBGA II (31x31)
Base Product Number P1011
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1 FRE
HTSUS 8542.31.0001
Other Names 935314344557
Standard Package 1
Microprocessor IC * 689-TEPBGA II (31x31)
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