NXP USA Inc. P1022NXN2LFB

P1022NXN2LFB


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P1022NXN2LFB
  • Package: 689-BBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: P1022NXN2LFB(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 689-BBGA Exposed Pad
Supplier Device Package 689-TEPBGA II (31x31)
Additional Interfaces DUART, I²C, I²S, MMC/SD, SPI
Base Product Number P1022
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935310406557
Standard Package 27
Mfr NXP USA Inc.
Series QorIQ P1
Package Tray
Product Status Obsolete
Core Processor PowerPC e500v2
Number of Cores/Bus Width 2 Core, 32-Bit
Speed 1.067GHz
Co-Processors/DSP -
RAM Controllers DDR2, DDR3
Graphics Acceleration No
Display & Interface Controllers LCD
Ethernet 10/100/1000Mbps (2)
SATA SATA 3Gbps (2)
USB USB 2.0 + PHY (2)
Voltage - I/O -
Operating Temperature -40°C ~ 125°C (TA)
Security Features -
PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 1.067GHz 689-TEPBGA II (31x31)
Contact Information
close