NXP USA Inc. P87LPC762BDH,512

P87LPC762BDH,512


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P87LPC762BDH,512
  • Package: 20-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: P87LPC762BDH,512(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC700
Package Tube
Product Status Obsolete
Core Processor 8051
Core Size 8-Bit
Speed 20MHz
Connectivity I²C, UART/USART
Peripherals Brown-out Detect/Reset, LED, POR, WDT
Number of I/O 18
Program Memory Size 2KB (2K x 8)
Program Memory Type OTP
EEPROM Size -
RAM Size 128 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 6V
Data Converters -
Oscillator Type Internal
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP
Base Product Number P87LPC762
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 75
8051 LPC700 Microcontroller IC 8-Bit 20MHz 2KB (2K x 8) OTP 20-TSSOP
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