NXP USA Inc. P87LPC779FDH,529

P87LPC779FDH,529


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P87LPC779FDH,529
  • Package: 20-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: P87LPC779FDH,529(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC700
Package Tube
Product Status Obsolete
Core Processor 8051
Core Size 8-Bit
Speed 20MHz
Connectivity I²C, UART/USART
Peripherals Brown-out Detect/Reset, POR, WDT
Number of I/O 18
Program Memory Size 8KB (8K x 8)
Program Memory Type OTP
EEPROM Size -
RAM Size 128 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 4x8b; D/A 2x8b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 20-TSSOP
Base Product Number P87LPC779
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 75
8051 LPC700 Microcontroller IC 8-Bit 20MHz 8KB (8K x 8) OTP 20-TSSOP
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