NXP USA Inc. P89LPC922FN112

P89LPC922FN112


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P89LPC922FN112
  • Package: 20-DIP (0.300", 7.62mm)
  • Datasheet: -
  • Stock: In stock
  • Description: P89LPC922FN112(Kg)

Details

Tags

Parameters
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 1
Mfr NXP USA Inc.
Series LPC900
Package Bulk
Product Status Active
Core Processor 8051
Core Size 8-Bit
Speed 18MHz
Connectivity I²C, UART/USART
Peripherals Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O 18
Program Memory Size 8KB (8K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 256 x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Through Hole
Package / Case 20-DIP (0.300", 7.62mm)
Supplier Device Package 20-DIP
Base Product Number P89LPC922
RoHS Status Not applicable
8051 LPC900 Microcontroller IC 8-Bit 18MHz 8KB (8K x 8) FLASH 20-DIP
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