NXP USA Inc. P89LPC9361FDH,518

P89LPC9361FDH,518


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: P89LPC9361FDH,518
  • Package: 28-TSSOP (0.173", 4.40mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: P89LPC9361FDH,518(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series LPC900
Package Tape & Reel (TR)
Product Status Obsolete
Core Processor 8051
Core Size 8-Bit
Speed 18MHz
Connectivity I²C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number of I/O 26
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size 512 x 8
RAM Size 768 x 8
Voltage - Supply (Vcc/Vdd) 2.4V ~ 3.6V
Data Converters A/D 8x8b; D/A 2x8b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 28-TSSOP
Base Product Number P89LPC9361
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 2,500
8051 LPC900 Microcontroller IC 8-Bit 18MHz 16KB (16K x 8) FLASH 28-TSSOP
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