NXP USA Inc. S32G274AABK0CUCT

S32G274AABK0CUCT


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: S32G274AABK0CUCT
  • Package: 525-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: S32G274AABK0CUCT(Kg)

Details

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Parameters
Mfr NXP USA Inc.
Series Automotive, AEC-Q100
Package Tray
Product Status Active
Core Processor ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width 4 Core, 64-Bit/3 Core, 32-Bit
Speed 400MHz, 1GHz
Co-Processors/DSP -
RAM Controllers DDR3L SDRAM, LPDDR4 DRAM
Graphics Acceleration -
Display & Interface Controllers -
Ethernet MII, RGMII, RMII, SGMII
SATA -
USB USB OTG (1)
Operating Temperature -40°C ~ 85°C (TA)
Security Features HSE-H
Mounting Type Surface Mount
Package / Case 525-FBGA, FCBGA
Supplier Device Package 525-FCPBGA (19x19)
Additional Interfaces CAN, FlexRay, I²C, SPI, UART
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE
Standard Package 420
ARM® Cortex®-A53, ARM® Cortex®-M7 Microprocessor IC Automotive, AEC-Q100 4 Core, 64-Bit/3 Core, 32-Bit 400MHz, 1GHz 525-FCPBGA (19x19)
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