NXP USA Inc. S9S12DT12F1MPVE

S9S12DT12F1MPVE


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: S9S12DT12F1MPVE
  • Package: 112-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: S9S12DT12F1MPVE(Kg)

Details

Tags

Parameters
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Other Names 935315532557
Standard Package 300
Mfr NXP USA Inc.
Series HCS12
Package Bulk
Product Status Not For New Designs
Core Processor HCS12
Core Size 16-Bit
Speed 25MHz
Connectivity CANbus, I²C, SCI, SPI
Peripherals PWM, WDT
Number of I/O 91
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
EEPROM Size 2K x 8
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 2.35V ~ 5.25V
Data Converters A/D 16x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 112-LQFP
Supplier Device Package 112-LQFP (20x20)
Base Product Number S9S12
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 112-LQFP (20x20)
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