NXP USA Inc. SAC57D54HCVMO

SAC57D54HCVMO


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SAC57D54HCVMO
  • Package: 516-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SAC57D54HCVMO(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MAC57Dxxx
Package Tray
Product Status Active
Core Processor ARM® Cortex®-A5/M4/M0+
Core Size 32-Bit Tri-Core
Speed 80MHz, 160MHz, 320MHz
Connectivity CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
Peripherals DMA, LCD, LVD/HVD, POR, PWM, WDT
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2.3M x 8
Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V
Data Converters A/D 24x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 516-BGA
Supplier Device Package 516-MAPBGA (27x27)
Base Product Number SAC57
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 200
ARM® Cortex®-A5/M4/M0+ MAC57Dxxx Microcontroller IC 32-Bit Tri-Core 80MHz, 160MHz, 320MHz 4MB (4M x 8) FLASH 516-MAPBGA (27x27)
Contact Information
close