NXP USA Inc. SC900841JVK

SC900841JVK


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SC900841JVK
  • Package: 338-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SC900841JVK(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Obsolete
Applications PC's, PDA's
Current - Supply -
Voltage - Supply -
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 338-TFBGA
Supplier Device Package 338-TFBGA (11x11)
Base Product Number SC900841
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 176
PC's, PDA's PMIC 338-TFBGA (11x11)
Contact Information
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