NXP USA Inc. SP5746BBK1AMMH6R

SP5746BBK1AMMH6R


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SP5746BBK1AMMH6R
  • Package: 100-LFBGA
  • Datasheet: -
  • Stock: In stock
  • Description: SP5746BBK1AMMH6R(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC57xx
Package Tape & Reel (TR)
Product Status Active
Core Processor e200z4
Core Size 32-Bit Single-Core
Speed 160MHz
Connectivity CANbus, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals DMA, I²S, POR, WDT
Program Memory Size 3MB (3M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 384K x 8
Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V
Data Converters A/D 36x10b, 16x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 100-LFBGA
Supplier Device Package 100-MAPBGA (11x11)
Base Product Number SP5746
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 935368953518
Standard Package 1,500
e200z4 MPC57xx Microcontroller IC 32-Bit Single-Core 160MHz 3MB (3M x 8) FLASH 100-MAPBGA (11x11)
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