NXP USA Inc. SP5746CHK1AMKU6R

SP5746CHK1AMKU6R


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SP5746CHK1AMKU6R
  • Package: 176-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: SP5746CHK1AMKU6R(Kg)

Details

Tags

Parameters
Product Status Active
Core Processor e200z2, e200z4
Core Size 32-Bit Dual-Core
Speed 80MHz/160MHz
Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals DMA, LVD, POR, WDT
Number of I/O 129
Program Memory Size 3MB (3M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 80x10b, 64x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Supplier Device Package 176-LQFP (24x24)
Base Product Number SP5746
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 935332837528
Standard Package 500
Mfr NXP USA Inc.
Series MPC57xx
Package Tape & Reel (TR)
e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/160MHz 3MB (3M x 8) FLASH 176-LQFP (24x24)
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