NXP USA Inc. SPAKXCL307VL160

SPAKXCL307VL160


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPAKXCL307VL160
  • Package: 196-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPAKXCL307VL160(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series DSP563xx
Package Tray
Product Status Obsolete
Type Fixed Point
Interface Host Interface, SSI, SCI
Clock Rate 160MHz
Non-Volatile Memory ROM (576B)
On-Chip RAM 576kB
Voltage - I/O 3.30V
Voltage - Core 1.80V
Operating Temperature -40°C ~ 100°C
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-LBGA (15x15)
Base Product Number SPAKX
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 2
Contact Information
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