NXP USA Inc. SPC5514GBMLQ66

SPC5514GBMLQ66


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5514GBMLQ66
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5514GBMLQ66(Kg)

Details

Tags

Parameters
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number SPC5514
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Other Names 935325476557
Standard Package 60
Mfr NXP USA Inc.
Series MPC55xx Qorivva
Package Tray
Product Status Obsolete
Core Processor e200z0, e200z1
Core Size 32-Bit Dual-Core
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 111
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V
Data Converters A/D 40x12b
Oscillator Type Internal
e200z0, e200z1 MPC55xx Qorivva Microcontroller IC 32-Bit Dual-Core 66MHz 512KB (512K x 8) FLASH 144-LQFP (20x20)
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