NXP USA Inc. SPC5516GBMLQ66

SPC5516GBMLQ66


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5516GBMLQ66
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5516GBMLQ66(Kg)

Details

Tags

Parameters
Supplier Device Package 144-LQFP (20x20)
Base Product Number SPC5516
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 300
Mfr NXP USA Inc.
Series MPC55xx Qorivva
Package Tray
Product Status Obsolete
Core Processor e200z0, e200z1
Core Size 32-Bit Dual-Core
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 111
Program Memory Size 1MB (1M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 64K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V
Data Converters A/D 40x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
e200z0, e200z1 MPC55xx Qorivva Microcontroller IC 32-Bit Dual-Core 66MHz 1MB (1M x 8) FLASH 144-LQFP (20x20)
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