NXP USA Inc. SPC5517EAMMG66
| Parameters | |
|---|---|
| Package / Case | 208-BGA |
| Supplier Device Package | 208-BGA (17x17) |
| Base Product Number | SPC5517 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
| Standard Package | 90 |
| Mfr | NXP USA Inc. |
| Series | MPC55xx Qorivva |
| Package | Tray |
| Product Status | Obsolete |
| Core Processor | e200z0, e200z1 |
| Core Size | 32-Bit Dual-Core |
| Speed | 66MHz |
| Connectivity | CANbus, EBI/EMI, I²C, SCI, SPI |
| Peripherals | DMA, POR, PWM, WDT |
| Number of I/O | 144 |
| Program Memory Size | 1.5MB (1.5M x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 80K x 8 |
| Voltage - Supply (Vcc/Vdd) | 4.5V ~ 5.25V |
| Data Converters | A/D 40x12b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
e200z0, e200z1 MPC55xx Qorivva Microcontroller IC 32-Bit Dual-Core 66MHz 1.5MB (1.5M x 8) FLASH 208-BGA (17x17)
