NXP USA Inc. SPC5517GAMMG66

SPC5517GAMMG66


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5517GAMMG66
  • Package: 208-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5517GAMMG66(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC55xx Qorivva
Package Tray
Product Status Obsolete
Core Processor e200z0, e200z1
Core Size 32-Bit Dual-Core
Speed 66MHz
Connectivity CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals DMA, POR, PWM, WDT
Number of I/O 144
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 80K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V
Data Converters A/D 40x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 208-BGA
Supplier Device Package 208-BGA (17x17)
Base Product Number SPC5517
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 90
e200z0, e200z1 MPC55xx Qorivva Microcontroller IC 32-Bit Dual-Core 66MHz 1.5MB (1.5M x 8) FLASH 208-BGA (17x17)
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