NXP USA Inc. SPC5775BDK3MME2
| Parameters | |
|---|---|
| Core Size | 32-Bit Dual-Core |
| Speed | 220MHz |
| Connectivity | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI |
| Peripherals | DMA, LVD, POR, Zipwire |
| Number of I/O | 293 |
| Program Memory Size | 4MB (4M x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 512K x 8 |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V |
| Data Converters | A/D 40x12b eQADCx2 |
| Oscillator Type | External |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 416-BGA |
| Supplier Device Package | 416-MAPBGA (27x27) |
| Base Product Number | SPC5775 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| ECCN | 5A992C |
| HTSUS | 8542.31.0001 |
| Standard Package | 200 |
| Mfr | NXP USA Inc. |
| Series | MPC57xx |
| Package | Tray |
| Product Status | Active |
| Core Processor | e200z7 |
e200z7 MPC57xx Microcontroller IC 32-Bit Dual-Core 220MHz 4MB (4M x 8) FLASH 416-MAPBGA (27x27)
