NXP USA Inc. SPC5775BDK3MME2R

SPC5775BDK3MME2R


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5775BDK3MME2R
  • Package: 416-BGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr NXP USA Inc.
Series MPC57xx
Package Tape & Reel (TR)
Product Status Active
Core Processor e200z7
Core Size 32-Bit Dual-Core
Speed 220MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART
Peripherals DMA, LVD, POR, Zipwire
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V, 5.5V
Data Converters -
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 416-BGA
Supplier Device Package 416-MAPBGA (27x27)
Base Product Number SPC5775
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 500
e200z7 MPC57xx Microcontroller IC 32-Bit Dual-Core 220MHz 4MB (4M x 8) FLASH 416-MAPBGA (27x27)
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