NXP USA Inc. SPC5775EDK3MME3R

SPC5775EDK3MME3R


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5775EDK3MME3R
  • Package: 416-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5775EDK3MME3R(Kg)

Details

Tags

Parameters
Number of I/O 293
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 40x12b eQADCx2
Oscillator Type External
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 416-BGA
Supplier Device Package 416-MAPBGA (27x27)
Base Product Number SPC5775
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Other Names 935370091518
Standard Package 500
Mfr NXP USA Inc.
Series MPC57xx
Package Tape & Reel (TR)
Product Status Active
Core Processor e200z7
Core Size 32-Bit Dual-Core
Speed 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire
e200z7 MPC57xx Microcontroller IC 32-Bit Dual-Core 264MHz 4MB (4M x 8) FLASH 416-MAPBGA (27x27)
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