NXP USA Inc. SPC5777CLK3MMO3R

SPC5777CLK3MMO3R


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5777CLK3MMO3R
  • Package: 516-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5777CLK3MMO3R(Kg)

Details

Tags

Parameters
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 16b Sigma-Delta, eQADC
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 516-BGA
Supplier Device Package 516-MAPBGA (27x27)
Base Product Number SPC5777
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A1
HTSUS 8542.31.0001
Other Names 935336418518
Standard Package 500
Mfr NXP USA Inc.
Series MPC57xx
Package Tape & Reel (TR)
Product Status Active
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 264MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, Zipwire
e200z7 MPC57xx Microcontroller IC 32-Bit Tri-Core 264MHz 8MB (8M x 8) FLASH 516-MAPBGA (27x27)
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