NXP USA Inc. SPC5777MK0MVU8

SPC5777MK0MVU8


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SPC5777MK0MVU8
  • Package: 416-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SPC5777MK0MVU8(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC57xx
Package Tray
Product Status Active
Core Processor e200z7
Core Size 32-Bit Tri-Core
Speed 300MHz
Connectivity CANbus, EBI/EMI, Ethernet, FlexRAY, I²C, LINbus, SPI, PSI, UART/USART
Peripherals DMA, LVD, POR, Zipwire
Program Memory Size 8.64MB (8M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 404K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 12b SAR, 16b Sigma-Delta
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 416-BBGA
Supplier Device Package 416-PBGA (27x27)
Base Product Number SPC5777
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.31.0001
Standard Package 200
e200z7 MPC57xx Microcontroller IC 32-Bit Tri-Core 300MHz 8.64MB (8M x 8) FLASH 416-PBGA (27x27)
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