NXP USA Inc. SSTUA32S868ET,518

SSTUA32S868ET,518


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SSTUA32S868ET,518
  • Package: 176-TFBGA
  • Datasheet: -
  • Stock: In stock
  • Description: SSTUA32S868ET,518(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Logic Type 1:2 Registered Buffer with Parity
Supply Voltage 1.7V ~ 2V
Number of Bits 28
Operating Temperature -
Mounting Type Surface Mount
Package / Case 176-TFBGA
Supplier Device Package 176-TFBGA (15x6)
Base Product Number SSTUA32S868
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 3,000
1:2 Registered Buffer with Parity IC 176-TFBGA (15x6)
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