NXP USA Inc. SSTUB32865ET/G,518

SSTUB32865ET/G,518


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SSTUB32865ET/G,518
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SSTUB32865ET/G,518(Kg)

Details

Tags

Parameters
Logic Type 1:2 Registered Buffer with Parity
Supply Voltage 1.7V ~ 2V
Number of Bits 28
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Package / Case 160-TFBGA
Supplier Device Package 160-TFBGA (13x9)
Base Product Number SSTUB32865
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 3,000
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
1:2 Registered Buffer with Parity IC 160-TFBGA (13x9)
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