NXP USA Inc. SSTUH32865ET,551

SSTUH32865ET,551


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: SSTUH32865ET,551
  • Package: 160-TFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: SSTUH32865ET,551(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Obsolete
Logic Type 1:2 Registered Buffer with Parity
Supply Voltage 1.7V ~ 1.9V
Number of Bits 28
Operating Temperature 0°C ~ 70°C
Mounting Type Surface Mount
Package / Case 160-TFBGA
Supplier Device Package 160-TFBGA (13x9)
Base Product Number SSTUH32865
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 119
1:2 Registered Buffer with Parity IC 160-TFBGA (13x9)
Contact Information
close