NXP USA Inc. TDA3608TH/N3C,518

TDA3608TH/N3C,518


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: TDA3608TH/N3C,518
  • Package: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: TDA3608TH/N3C,518(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Obsolete
Applications Processor
Current - Supply 500µA
Voltage - Supply 9.5V ~ 18V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package 20-HSOP
Base Product Number TDA3608
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 500
Processor PMIC 20-HSOP
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