NXP USA Inc. TDF8591TH/N1TJ

TDF8591TH/N1TJ


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: TDF8591TH/N1TJ
  • Package: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: TDF8591TH/N1TJ(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series Automotive, AEC-Q100
Package Tape & Reel (TR)
Product Status Obsolete
Type Class D
Output Type -
Max Output Power x Channels @ Load 100W x 2 @ 4Ohm
Voltage - Supply 14V ~ 29V
Features Depop, Short-Circuit and Thermal Protection
Mounting Type Surface Mount
Operating Temperature -
Supplier Device Package 24-HSOP
Package / Case 24-BSOP (0.433", 11.00mm Width) Exposed Pad
Base Product Number TDF859
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Other Names 935298696118
Standard Package 500
Amplifier IC Class D 24-HSOP
Contact Information
close