NXP USA Inc. TEA2209T/1J

TEA2209T/1J


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: TEA2209T/1J
  • Package: 16-SOIC (0.154", 3.90mm Width)
  • Datasheet: PDF
  • Stock: In stock
  • Description: TEA2209T/1J(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tape & Reel (TR)
Product Status Active
Applications Desktop, Notebook PCs
Current - Supply 2mA
Voltage - Supply 440V
Operating Temperature -40°C ~ 125°C (TJ)
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package 16-SO
Base Product Number TEA2209
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001
Standard Package 2,500
Desktop, Notebook PCs PMIC 16-SO
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