NXP USA Inc. XC56309VF100AR2

XC56309VF100AR2


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: XC56309VF100AR2
  • Package: 196-LBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XC56309VF100AR2(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series DSP563xx
Package Tape & Reel (TR)
Product Status Obsolete
Type Fixed Point
Interface Host Interface, SSI, SCI
Clock Rate 100MHz
Non-Volatile Memory ROM (576B)
On-Chip RAM 24kB
Voltage - I/O 3.30V
Voltage - Core 3.30V
Operating Temperature -40°C ~ 105°C (TJ)
Mounting Type Surface Mount
Package / Case 196-LBGA
Supplier Device Package 196-LBGA (15x15)
Base Product Number XC56
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 750
Contact Information
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