NXP USA Inc. XPC823ECZT66BA

XPC823ECZT66BA


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: XPC823ECZT66BA
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XPC823ECZT66BA(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series -
Package Tray
Product Status Not For New Designs
Core Processor PowerPC
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 66MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers -
Graphics Acceleration No
Display & Interface Controllers LCD, Video
Ethernet 10Mbps (1)
SATA -
USB USB 1.x (1)
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 95°C (TJ)
Security Features -
Mounting Type Surface Mount
Package / Case 256-BBGA
Supplier Device Package 256-PBGA (23x23)
Additional Interfaces I²C, SMC, SCC, SPI, UART
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.31.0001
Other Names 2832-XPC823ECZT66BA
Standard Package 12
PowerPC Microprocessor IC - 1 Core, 32-Bit 66MHz 256-PBGA (23x23)
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