NXP USA Inc. XPC8260CVVIHBC

XPC8260CVVIHBC


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: XPC8260CVVIHBC
  • Package: 480-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XPC8260CVVIHBC(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 480-LBGA Exposed Pad
Supplier Device Package 480-TBGA (37.5x37.5)
Additional Interfaces I²C, SCC, SMC, SPI, UART, USART
Base Product Number XPC82
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B4B
HTSUS 8542.31.0001
Other Names 935309851557
Standard Package 21
Mfr NXP USA Inc.
Series MPC82xx
Package Tray
Product Status Obsolete
Core Processor PowerPC G2
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 200MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (3)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature -40°C ~ 105°C (TA)
Security Features -
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)
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