NXP USA Inc. XPC8260VVIFBC

XPC8260VVIFBC


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: XPC8260VVIFBC
  • Package: 480-LBGA Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
  • Description: XPC8260VVIFBC(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC82xx
Package Tray
Product Status Obsolete
Core Processor PowerPC G2
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 200MHz
Co-Processors/DSP Communications; RISC CPM
RAM Controllers DRAM, SDRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10/100Mbps (3)
SATA -
USB -
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 105°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 480-LBGA Exposed Pad
Supplier Device Package 480-TBGA (37.5x37.5)
Additional Interfaces I²C, SCC, SMC, SPI, UART, USART
Base Product Number XPC82
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A991B4B
HTSUS 8542.31.0001
Other Names 935325391557
Standard Package 21
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)
Contact Information
close