NXP USA Inc. XPC850DEZT66BU

XPC850DEZT66BU


  • Manufacturer: NXP USA Inc.
  • CONEVO NO: XPC850DEZT66BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: XPC850DEZT66BU(Kg)

Details

Tags

Parameters
Mfr NXP USA Inc.
Series MPC8xx
Package Tray
Product Status Obsolete
Core Processor MPC8xx
Number of Cores/Bus Width 1 Core, 32-Bit
Speed 66MHz
Co-Processors/DSP Communications; CPM
RAM Controllers DRAM
Graphics Acceleration No
Display & Interface Controllers -
Ethernet 10Mbps (1)
SATA -
USB USB 1.x (1)
Voltage - I/O 3.3V
Operating Temperature 0°C ~ 95°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 256-BGA
Supplier Device Package 256-PBGA (23x23)
Additional Interfaces HDLC/SDLC, I²C, IrDA, PCMCIA-ATA, TDM, UART/USART
Base Product Number XPC85
RoHS Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A001A3
HTSUS 8542.31.0001
Standard Package 60
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)
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