Renesas Electronics America Inc D6417709SHF200BV

D6417709SHF200BV


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: D6417709SHF200BV
  • Package: 208-BFQFP Exposed Pad
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr Renesas Electronics America Inc
Series SuperH® SH7700
Package Tray
Product Status Obsolete
Core Processor SH-3
Core Size 32-Bit Single-Core
Speed 200MHz
Connectivity EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals DMA, POR, WDT
Number of I/O 96
Program Memory Size -
Program Memory Type ROMless
EEPROM Size -
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 1.85V ~ 2.15V
Data Converters A/D 8x10b; D/A 2x8b
Oscillator Type Internal
Operating Temperature -20°C ~ 75°C (TA)
Mounting Type Surface Mount
Package / Case 208-BFQFP Exposed Pad
Supplier Device Package 208-HQFP (28x28)
Base Product Number D6417709
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
SH-3 SuperH® SH7700 Microcontroller IC 32-Bit Single-Core 200MHz ROMless 208-HQFP (28x28)
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