Renesas Electronics America Inc DF2117VBG20V

DF2117VBG20V


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: DF2117VBG20V
  • Package: 176-LFBGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: DF2117VBG20V(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series H8® H8S/2100
Package Tray
Product Status Not For New Designs
Core Processor H8S/2600
Core Size 16-Bit
Speed 20MHz
Connectivity FIFO, I²C, LPC, SCI, SmartCard
Peripherals POR, PWM, WDT
Number of I/O 128
Program Memory Size 160KB (160K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 16x10b
Oscillator Type External
Operating Temperature -20°C ~ 75°C (TA)
Mounting Type Surface Mount
Package / Case 176-LFBGA
Supplier Device Package 176-LFBGA (13x13)
Base Product Number DF2117
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Other Names DF2117VBG20RV
Standard Package 152
H8S/2600 H8® H8S/2100 Microcontroller IC 16-Bit 20MHz 160KB (160K x 8) FLASH 176-LFBGA (13x13)
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