Renesas Electronics America Inc DF2667VFQ33V

DF2667VFQ33V


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: DF2667VFQ33V
  • Package: 144-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: DF2667VFQ33V(Kg)

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Parameters
Mfr Renesas Electronics America Inc
Series H8® H8S/2600
Package Tray
Product Status Active
Core Processor H8S/2600
Core Size 16-Bit
Speed 33MHz
Connectivity IrDA, SCI, SmartCard
Peripherals POR, PWM, WDT
Number of I/O 115
Program Memory Size 384KB (384K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 12x10b; D/A 4x8b
Oscillator Type Internal
Operating Temperature -20°C ~ 75°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP
Supplier Device Package 144-LQFP (20x20)
Base Product Number DF2667
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
H8S/2600 H8® H8S/2600 Microcontroller IC 16-Bit 33MHz 384KB (384K x 8) FLASH 144-LQFP (20x20)
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