Renesas Electronics America Inc DF3026XBL25V

DF3026XBL25V


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: DF3026XBL25V
  • Package: 100-TQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: DF3026XBL25V(Kg)

Details

Tags

Parameters
Mfr Renesas Electronics America Inc
Series H8® H8/300H
Package Tray
Product Status Obsolete
Core Processor H8/300H
Core Size 16-Bit
Speed 25MHz
Connectivity SCI, SmartCard
Peripherals PWM, WDT
Number of I/O 70
Program Memory Size 256KB (256K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Data Converters A/D 8x10b; D/A 2x8b
Oscillator Type Internal
Operating Temperature -20°C ~ 75°C (TA)
Mounting Type Surface Mount
Package / Case 100-TQFP
Base Product Number DF3026
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001
Standard Package 1
H8/300H H8® H8/300H Microcontroller IC 16-Bit 25MHz 256KB (256K x 8) FLASH
Contact Information
close