Renesas Electronics America Inc DF38444XWV

DF38444XWV


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: DF38444XWV
  • Package: 100-TQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: DF38444XWV(Kg)

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Parameters
Mfr Renesas Electronics America Inc
Series H8® H8/300L SLP
Package Tray
Product Status Obsolete
Core Processor H8/300L
Core Size 8-Bit
Speed 8MHz
Connectivity CSI, SPI, UART/USART
Peripherals LCD, PWM, WDT
Number of I/O 71
Program Memory Size 32KB (32K x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Data Converters A/D 12x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 100-TQFP
Supplier Device Package 100-TQFP (14x14)
Base Product Number DF38444
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN OBSOLETE
Other Names 559-DF38444XWV
Standard Package 1
H8/300L H8® H8/300L SLP Microcontroller IC 8-Bit 8MHz 32KB (32K x 8) FLASH 100-TQFP (14x14)
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