Renesas Electronics America Inc R7F0E016D2DBN#HA1

R7F0E016D2DBN#HA1


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7F0E016D2DBN#HA1
  • Package: 156-XFBGA
  • Datasheet: -
  • Stock: In stock
  • Description: R7F0E016D2DBN#HA1(Kg)

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Parameters
Mfr Renesas Electronics America Inc
Series RE01
Package Tape & Reel (TR)
Product Status Active
Core Processor ARM® Cortex®-M0+
Core Size 32-Bit Single-Core
Speed 24MHz
Connectivity I²C, IrDA, SCI, SPI, UART/USART, USB
Peripherals DMA, LCD, LVD, POR, PWM, WDT
Number of I/O 102
Program Memory Size 1.5MB (1.5M x 8)
Program Memory Type FLASH
EEPROM Size -
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V
Data Converters A/D 18x14b SAR; D/A 1x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 156-XFBGA
Supplier Device Package 156-WLBGA (4.47x4.27)
Base Product Number R7F0E016
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A002A REN
HTSUS 8542.31.0001
Standard Package 2,000
ARM® Cortex®-M0+ RE01 Microcontroller IC 32-Bit Single-Core 24MHz 1.5MB (1.5M x 8) FLASH 156-WLBGA (4.47x4.27)
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