Renesas Electronics America Inc R7F701275EABG-C#BC6

R7F701275EABG-C#BC6


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7F701275EABG-C#BC6
  • Package: 252-FBGA
  • Datasheet: PDF
  • Stock: In stock
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Parameters
Mfr Renesas Electronics America Inc
Series RH850/C1M-Ax
Package Tray
Product Status Active
Core Processor RH850G3MH
Core Size 32-Bit Dual-Core
Speed 320MHz
Connectivity CANbus, CSI, LINbus, SCI
Peripherals DMA, PWM, WDT
Number of I/O 99
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 320K x 8
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V
Data Converters A/D 48x12b SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case 252-FBGA
Supplier Device Package 252-FBGA (17x17)
Base Product Number R7F701275
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
HTSUS 8542.31.0001
Standard Package 720
RH850G3MH RH850/C1M-Ax Microcontroller IC 32-Bit Dual-Core 320MHz 4MB (4M x 8) FLASH 252-FBGA (17x17)
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