Renesas Electronics America Inc R7F701461EABG-C#BC0

R7F701461EABG-C#BC0


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7F701461EABG-C#BC0
  • Package: 272-BGA
  • Datasheet: -
  • Stock: In stock
  • Description: R7F701461EABG-C#BC0(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series RH850/D1x
Package Tray
Product Status Active
Core Processor RH850G3M
Core Size 32-Bit
Speed 240MHz
Connectivity CANbus, CSI, Ethernet, I²C, LINbus, UART/USART
Peripherals DMA, I²S, POR, PWM, Temp Sensor, WDT
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 2.9M x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 16x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 150°C (TJ)
Mounting Type Surface Mount
Package / Case 272-BGA
Supplier Device Package 272-BGA (21x21)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Other Names 559-R7F701461EABG-C#BC0
Standard Package 540
RH850G3M RH850/D1x Microcontroller IC 32-Bit 240MHz 4MB (4M x 8) FLASH 272-BGA (21x21)
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