Renesas Electronics America Inc R7F7016513ABG-C#HC1

R7F7016513ABG-C#HC1


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7F7016513ABG-C#HC1
  • Package: 233-BGA
  • Datasheet: PDF
  • Stock: In stock
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Details

Tags

Parameters
Series Automotive, AEC-Q100, RH850/F1KM-S4
Package Tape & Reel (TR)
Product Status Active
Core Processor RH850G3KH
Core Size 32-Bit Single-Core
Speed 240MHz
Connectivity CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals DMA, PWM, WDT
Number of I/O 174
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 128K x 8
RAM Size 512K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 38x10b, 32x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 233-BGA
Supplier Device Package 233-FPBGA
Base Product Number R7F7016513
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Other Names 559-R7F7016513ABG-C#HC1TR
Standard Package 1,000
Mfr Renesas Electronics America Inc
RH850G3KH Automotive, AEC-Q100, RH850/F1KM-S4 Microcontroller IC 32-Bit Single-Core 240MHz 4MB (4M x 8) FLASH 233-FPBGA
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