Renesas Electronics America Inc R7F7017113ABG-C#BC1
| Parameters | |
|---|---|
| Mfr | Renesas Electronics America Inc |
| Series | Automotive, AEC-Q100, RH850/F1H-D8 |
| Package | Tray |
| Product Status | Active |
| Core Processor | RH850G3KH |
| Core Size | 32-Bit Dual-Core |
| Speed | 240MHz |
| Connectivity | CANbus, CSI, I²C, LINbus, SPI, UART/USART |
| Peripherals | DMA, PWM, WDT |
| Number of I/O | 174 |
| Program Memory Size | 8MB (8M x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 1M x 8 |
| RAM Size | 256K x 8 |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 5.5V |
| Data Converters | A/D 38x10b, 32x12b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 233-BGA |
| Supplier Device Package | 233-FPBGA |
| Base Product Number | R7F7017113 |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| REACH Status | REACH Unaffected |
| Other Names | 559-R7F7017113ABG-C#BC1 |
| Standard Package | 1,071 |
RH850G3KH Automotive, AEC-Q100, RH850/F1H-D8 Microcontroller IC 32-Bit Dual-Core 240MHz 8MB (8M x 8) FLASH 233-FPBGA
