Renesas Electronics America Inc R7F7017113ABG-C#BC1

R7F7017113ABG-C#BC1


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7F7017113ABG-C#BC1
  • Package: 233-BGA
  • Datasheet: PDF
  • Stock: In stock
  • Description: R7F7017113ABG-C#BC1(Kg)

Details

Tags

Parameters
Mfr Renesas Electronics America Inc
Series Automotive, AEC-Q100, RH850/F1H-D8
Package Tray
Product Status Active
Core Processor RH850G3KH
Core Size 32-Bit Dual-Core
Speed 240MHz
Connectivity CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals DMA, PWM, WDT
Number of I/O 174
Program Memory Size 8MB (8M x 8)
Program Memory Type FLASH
EEPROM Size 1M x 8
RAM Size 256K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 38x10b, 32x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 233-BGA
Supplier Device Package 233-FPBGA
Base Product Number R7F7017113
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Other Names 559-R7F7017113ABG-C#BC1
Standard Package 1,071
RH850G3KH Automotive, AEC-Q100, RH850/F1H-D8 Microcontroller IC 32-Bit Dual-Core 240MHz 8MB (8M x 8) FLASH 233-FPBGA
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