Renesas Electronics America Inc R7FA2E2A32DBY#HC1

R7FA2E2A32DBY#HC1


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R7FA2E2A32DBY#HC1
  • Package: 16-UFBGA, WLCSP
  • Datasheet: PDF
  • Stock: In stock
  • Description: R7FA2E2A32DBY#HC1(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series RA2E2
Package Tape & Reel (TR)
Product Status Active
Core Processor ARM® Cortex®-M23
Core Size 32-Bit
Speed 48MHz
Connectivity I²C, I³C, SCI, SmartCard, SPI, UART/USART
Peripherals AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
Number of I/O 11
Program Memory Size 16KB (16K x 8)
Program Memory Type FLASH
EEPROM Size 2K x 8
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
Data Converters A/D 4x12b SAR
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 16-UFBGA, WLCSP
Supplier Device Package 16-WLCSP (1.84x1.87)
Base Product Number R7FA2E2
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Standard Package 2,000
ARM® Cortex®-M23 RA2E2 Microcontroller IC 32-Bit 48MHz 16KB (16K x 8) FLASH 16-WLCSP (1.84x1.87)
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