Renesas Electronics America Inc R8A774A0HA01BG#G2

R8A774A0HA01BG#G2


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: R8A774A0HA01BG#G2
  • Package: 1022-BGA
  • Datasheet: -
  • Stock: In stock
  • Description: R8A774A0HA01BG#G2(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series RZ/G2M
Package Tray
Product Status Active
Core Processor ARM® Cortex®-A53, ARM® Cortex®-A57
Number of Cores/Bus Width 6 Core, 64-Bit
Speed 1.2GHz, 1.5GHz
Co-Processors/DSP -
RAM Controllers LPDDR4
Graphics Acceleration No
Display & Interface Controllers DU
Ethernet 10/100Mbps (1), 100/1000Mbps (1)
SATA -
USB USB (2)
Voltage - I/O 0.82V, 1.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA)
Security Features -
Mounting Type Surface Mount
Package / Case 1022-BGA
Supplier Device Package 1022-FPBGA (29x29)
Additional Interfaces CAN, I²C, SCI, SPI
Base Product Number R8A774
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Standard Package 180
ARM® Cortex®-A53, ARM® Cortex®-A57 Microprocessor IC RZ/G2M 6 Core, 64-Bit 1.2GHz, 1.5GHz 1022-FPBGA (29x29)
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