Renesas Electronics America Inc UPD70F3370M2GBA-GAH-AX

UPD70F3370M2GBA-GAH-AX


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: UPD70F3370M2GBA-GAH-AX
  • Package: 64-LQFP
  • Datasheet: PDF
  • Stock: In stock
  • Description: UPD70F3370M2GBA-GAH-AX(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series V850ES/FE3
Package Tray
Product Status Obsolete
Core Processor V850ES
Core Size 32-Bit Single-Core
Speed 32MHz
Connectivity CANbus, CSI, I²C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Number of I/O 51
Program Memory Size 128KB (128K x 8)
Program Memory Type FLASH
EEPROM Size 32K x 8
RAM Size 8K x 8
Voltage - Supply (Vcc/Vdd) 3.3V ~ 5.5V
Data Converters A/D 10x10b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
Supplier Device Package 64-LFQFP (10x10)
Base Product Number UPD70F3370
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 1
V850ES V850ES/FE3 Microcontroller IC 32-Bit Single-Core 32MHz 128KB (128K x 8) FLASH 64-LFQFP (10x10)
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