Renesas Electronics America Inc UPD70F3529GMA9-GBK-Q-G

UPD70F3529GMA9-GBK-Q-G


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: UPD70F3529GMA9-GBK-Q-G
  • Package: 176-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: UPD70F3529GMA9-GBK-Q-G(Kg)

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Mfr Renesas Electronics America Inc
Series Automotive, AEC-Q100, V850E2/Dx4-H
Package Tray
Product Status Not For New Designs
Core Processor V850E2M
Core Size 32-Bit Single-Core
Speed 80MHz
Connectivity CANbus, CSI, I²C, LINbus, SPI, UART/USART
Peripherals DMA, I²S, LCD, LVD, POR, PWM, WDT
Number of I/O 127
Program Memory Size 2GB (2G x 8)
Program Memory Type FLASH
EEPROM Size 32K x 8
RAM Size 96K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 12x10b, 12x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Supplier Device Package 176-HLQFP (24x24)
Base Product Number UPD70F3529
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001
Standard Package 40
V850E2M Automotive, AEC-Q100, V850E2/Dx4-H Microcontroller IC 32-Bit Single-Core 80MHz 2GB (2G x 8) FLASH 176-HLQFP (24x24)
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