Renesas Electronics America Inc UPD70F3551M1GJA1-GBG-QS-AX

UPD70F3551M1GJA1-GBG-QS-AX


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: UPD70F3551M1GJA1-GBG-QS-AX
  • Package: 144-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: UPD70F3551M1GJA1-GBG-QS-AX(Kg)

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Parameters
Mfr Renesas Electronics America Inc
Series V850E2/Fx4
Package Bulk
Product Status Active
Core Processor V850E2M
Core Size 32-Bit Single-Core
Speed 80MHz
Connectivity CANbus, CSI, I²C, LINbus, UART/USART
Peripherals DMA, POR, PWM, WDT
Number of I/O 112
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size 32K x 8
RAM Size 48K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 24x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 110°C (TA)
Mounting Type Surface Mount
Package / Case 144-LQFP Exposed Pad
Supplier Device Package 144-HLFQFP (20x20)
Base Product Number UPD70F3551
RoHS Status Not applicable
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status Vendor Undefined
ECCN 3A991
HTSUS 8542.31.0001
Standard Package 1
V850E2M V850E2/Fx4 Microcontroller IC 32-Bit Single-Core 80MHz 512KB (512K x 8) FLASH 144-HLFQFP (20x20)
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