Renesas Electronics America Inc UPD70F3558M2GM-GBK-AX

UPD70F3558M2GM-GBK-AX


  • Manufacturer: Renesas Electronics America Inc
  • CONEVO NO: UPD70F3558M2GM-GBK-AX
  • Package: 176-LQFP Exposed Pad
  • Datasheet: -
  • Stock: In stock
  • Description: UPD70F3558M2GM-GBK-AX(Kg)

Details

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Parameters
Mfr Renesas Electronics America Inc
Series V850E2/Fx4
Package Bulk
Product Status Obsolete
Core Processor V850E2M
Core Size 32-Bit
Speed 80MHz
Connectivity CANbus, CSI, I²C, LINbus, UART/USART
Peripherals DMA, POR, PWM, WDT
Number of I/O 137
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 144K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Data Converters A/D 40x12b
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 176-LQFP Exposed Pad
Supplier Device Package 176-HLQFP (24x24)
Base Product Number UPD70F3558
REACH Status REACH Unaffected
ECCN OBSOLETE
Other Names 559-UPD70F3558M2GM-GBK-AX
Standard Package 1
V850E2M V850E2/Fx4 Microcontroller IC 32-Bit 80MHz 2MB (2M x 8) FLASH 176-HLQFP (24x24)
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